| 摘要 |
Disclosed are an LED flexible printed circuit board (PCB) and a manufacturing method thereof. A method for manufacturing an LED flexible PCB according to an embodiment of the present invention comprises the steps of: sequentially stacking first prepreg, polyimide, second prepreg and a copper layer on an upper part of a heat dissipation plate and applying pressure to the stacked layers at a preset temperature; forming a circuit pattern through a series of D/F exposure to light, development and corrosion on the stacked copper layer of a substrate; performing solder masking and silk printing or performing cover-lay punching and stacking on the substrate having the circuit pattern formed thereon; performing an etching process on the heat dissipation plate such that the heat dissipation plate can be remained in an area corresponding to a back surface of an LED mounting portion on which an LED is mounted and can be removed in a connection portion for electrically connecting the LED mounting portions, among the heat dissipation plates of the substrate on which the solder masking and the silk printing or the cover-lay punching and the stacking are performed; and performing surface treatment on the substrate in which the heat dissipation plat etching is completed. |
