发明名称 INSULATIVE PARTICLE-ADHERED CONDUCTIVE PARTICLE AND PRODUCTION METHOD THEREOF, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an insulative particle-adhered conductive particle that can increase the conduction reliability and insulation reliability after conductive connection.SOLUTION: The insulative particle-adhered conductive particle according to the present invention includes an insulative particle-adhered conductive particle body, and a coat coating the surface of the insulative particle-adhered conductive particle body, and in which: the insulative particle-adhered conductive particle body has a conductive particle having, at least on a surface thereof, a conductive portion, and a plurality of insulative particles disposed over the surface of the conductive particle; the conductive particle has a plurality of protrusions on the outer surface of the conductive portion; the average height of the protrusion is 0.05 μm or more and 0.5 μm or less; the coat has a first coat portion covering the conductive particle, and a second coat portion covering the surface of the insulative particle; and the ratio of the thickness at the first coat portion to the average particle size of the insulative particle is 2/3 or more and 3 or less.SELECTED DRAWING: Figure 1
申请公布号 JP2016085988(A) 申请公布日期 2016.05.19
申请号 JP20150212008 申请日期 2015.10.28
申请人 SEKISUI CHEM CO LTD 发明人 MAHARA SHIGEO
分类号 H01B5/00;H01B1/00;H01B1/22;H01R11/01 主分类号 H01B5/00
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