PACKAGE, METHOD OF MANUFACTURING PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS AND MOBILE

摘要

PROBLEM TO BE SOLVED: To provide a package capable of enhancing the bond strength of a base substrate and a lid.SOLUTION: A package 20 includes a package base 21, a lid 22 having optical transparency arranged to overlap the package base 21, in the plan view from the thickness direction of the package base 21, and a low melting point glass 25 arranged between the package base 21 and lid 22, and bonded thereto. The low melting point glass 25 has an area where the width of the cross section in the thickness direction is widened toward the bonding surface 22a of the lid 22.SELECTED DRAWING: Figure 1