BONDING MATERIAL AND BONDING METHOD USING SAME

摘要

A bonding material of a silver paste includes: fine silver particles having an average primary particle diameter of 1 to 50 nanometers, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 micrometers, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing 3 to 7% by weight of an alcohol and 0.3 to 1% by weight of a triol; a dispersant containing 0.5 to 2% by weight of an acid dispersant and 0.01 to 0.1% by weight of phosphate ester dispersant; and 0.01 to 0.1% by weight of a sintering aid, such as diglycolic acid, wherein the content of the fine silver particles is in the range of from 5% by weight to 30% by weight, and the content of the silver particles is in the range of from 60% by weight to 90% by weight, the content of the total of the fine silver particles and the silver particles being not less than 90% by weight.

主权项

1. A bonding material of a silver paste comprising:
fine silver particles having an average primary particle diameter of 1 to 50 nanometers; silver particles having an average primary particle diameter of 0.5 to 4 micrometers; a solvent; and a dispersant, wherein the content of the fine silver particles is in the range of from 5% by weight to 30% by weight, and the content of the silver particles is in the range of from 60% by weight to 90% by weight, the content of the total of the fine silver particles and the silver particles being not less than 90% by weight.