发明名称 BALUNS FOR RF SIGNAL CONVERSION AND IMPEDANCE MATCHING
摘要 A magnetically-coupled structure is integrated with an integrated circuit in back end-of-line (BEOL) digital CMOS fabrication processes. A differential primary (or secondary) coil is formed by patterning a thick copper (Cu) metal layer, and a single-ended secondary (or primary) coil is formed by patterning a thick aluminum (Al) top metal bonding layer. Crossovers and/or cross-unders are formed using thin metal layers. One embodiment provides a stacked balun with a differential primary input winding defined in the copper layer, directly underneath a single-ended spiral winding defined in the aluminum layer. The spiral forms the single-ended secondary output of the balun and is rotated by 90° to prevent metal shorting for its cross-under connections. Another embodiment provides a transformer with one differential primary (or secondary) coil defined in the copper layer and another differential secondary (or primary) coil defined in the aluminum layer and adding a center tap. The position of the tap is selected to compensate for phase differences and provide desired balance.
申请公布号 US2016142036(A1) 申请公布日期 2016.05.19
申请号 US201615003030 申请日期 2016.01.21
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 Akhtar Siraj;Taylor Richard Francis;Litmanen Petteri
分类号 H03H7/42;H01F27/29;H01F41/04;H01F27/28 主分类号 H03H7/42
代理机构 代理人
主权项 1: A method of manufacturing a magnetically coupled structure incorporated on a chip with an integrated circuit, integrated within a process for fabrication of the integrated circuit, comprising: forming a first coil comprising a first generally planar multi-turn metal winding by patterning a copper metal layer formed for the manufacture of the integrated circuit; forming a second coil in a stacked configuration with the first coil, the second coil comprising a second generally planar multi-turn metal winding, by patterning a top metal bonding layer formed for the manufacture of the integrated circuit; and forming crossings between turns of the respective coils by patterning one or more other metal layers formed for the manufacture of the integrated circuit, the one or more other metal layers being thinner than the copper metal layer and top metal bonding layer, wherein said crossings include first crossings for the first coil and a second crossing for the second coil.
地址 Dallas TX US