发明名称 THIN-SLICE MANUFACTURING DEVICE AND THIN-SLICE MANUFACTURING METHOD
摘要 A thin-slice manufacturing device is a thin-slice manufacturing device for cutting an embedding block in which a biological sample is embedded by paraffin using a cutting blade relatively moved with respect to the embedding block along a virtual plane to cut out thin slices, the thin-slice manufacturing device includes a vertical illumination part configured to radiate light to the embedding block, and an inclination estimation part configured to detect a boundary line between a cutting surface cut along the virtual plane and a non-cutting surface based on reflection of light generated by the light radiated to the embedding block by the vertical illumination part, and estimate inclination information showing information related to inclination of the embedding block based on the detected boundary line.
申请公布号 US2016139006(A1) 申请公布日期 2016.05.19
申请号 US201414897944 申请日期 2014.06.26
申请人 SAKURA FINETEK JAPAN CO., LTD. 发明人 MIYATANI Tatsuya
分类号 G01N1/06;G01N1/36 主分类号 G01N1/06
代理机构 代理人
主权项 1. A thin-slice manufacturing device for cutting an embedding block in which a sample is embedded by an embedding agent by using a cutting blade relatively moved with respect to the embedding block along a virtual plane to cut out thin slices, the thin-slice manufacturing device comprising: a radiation part configured to radiate light to the embedding block; and an estimation part configured to detect a boundary line between a cutting surface and a non-cutting surface formed by cutting the embedding block along the virtual plane based on reflection of light generated by the light radiated to the embedding block from the radiation part, and configured to estimate inclination information regarding an inclination of the embedding block based on the detected boundary line.
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