发明名称 硬化性エポキシ樹脂組成物及びこれを使用した光半導体装置
摘要 A curable epoxy resin composition according to the present invention is a curable epoxy resin composition which includes a rubber-particle-dispersed epoxy compound (A) including an alicyclic epoxy compound and, dispersed therein, rubber particles. The curable epoxy resin composition further includes an alumina (B); and an aliphatic polyglycidyl ether (C) having a viscosity of 8000 mPa·s or more at 25°C. The rubber particles include a polymer derived from a (meth)acrylic ester as an essential monomer component, have hydroxyl group and/or carboxyl group on a surface thereof, and have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm. The curable epoxy resin composition gives a cured product having a refractive index with a difference from the refractive index of the rubber particles of within ±0.03.
申请公布号 JP5918699(B2) 申请公布日期 2016.05.18
申请号 JP20120549738 申请日期 2011.12.13
申请人 株式会社ダイセル 发明人 竹中 洋登
分类号 C08L63/00;C08G59/20;C08K3/22;C08L33/06;H01L23/29;H01L23/31 主分类号 C08L63/00
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