| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device with short time for wafer exchange in a mounting process in a post-process of semiconductor manufacturing and with high operation efficiency and to provide a semiconductor manufacturing method. <P>SOLUTION: The semiconductor manufacturing device includes: a wafer cassette which is freely detachable from a device body of the semiconductor manufacturing device; a wafer carrier which can be stored in the wafer cassette, on which a wafer is placed and to which a bar code for holding information of a semiconductor chip is stuck; a rotatable buffer table on which the wafer carrier can be placed; and a bar code reader. The bar code reader includes: a buffer device for performing an alignment operation for aligning a direction of the wafer carrier with a direction for a mounting operation to a mounted member after a reading operation of the bar code of the wafer carrier; an XYθ table for transporting the wafer carrier between the buffer device and a pickup position of the semiconductor chip; and a mounting mechanism for mounting the semiconductor chip on the mounted member. <P>COPYRIGHT: (C)2013,JPO&INPIT |
