| 摘要 |
An adhesive tape is attached with high precision to a ring frame and a back surface of a semiconductor wafer provided with a ring-shape convex portion for reinforcement at the outer circumference of the back surface. a ring-shaped holding unit (16) holds a ring-shaped convex portion of a wafer on which an ID including texts and signs or combination thereof is engraved, to be convex from a holding table (13), the engraved area of the wafer is held by a holding area (18) protruding from the inside of the holding unit (16) to come in contact. In this state, the adhesive tape between the ring frame and the wafer is sandwiched by a pair of housings, differential pressures are generated in two spaces partitioned by the adhesive tape in the formed chamber, and the adhesive tape is attached to the back surface of the wafer while being depressed and curved. |
