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发明名称
LEDチップの実装方法
摘要
申请公布号
JP5920143(B2)
申请公布日期
2016.05.18
申请号
JP20120210570
申请日期
2012.09.25
申请人
豊田合成株式会社
发明人
土屋 陽祐;下西 正太;田嶌 博幸;仙石 昌
分类号
H01L33/62
主分类号
H01L33/62
代理机构
代理人
主权项
地址
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