发明名称 半導体装置及び半導体装置の作製方法
摘要 An objet of the present invention is to provide a semiconductor device with a new structure. Disclosed is a semiconductor device including a first transistor which includes a channel formation region on a substrate containing a semiconductor material, impurity regions formed with the channel formation region interposed therebetween, a first gate insulating layer over the channel formation region, a first gate electrode over the first gate insulating layer, and a first source electrode and a first drain electrode which are electrically connected to the impurity region; and a second transistor which includes a second gate electrode over the substrate containing a semiconductor material, a second gate insulating layer over the second gate electrode, an oxide semiconductor layer over the second gate insulating layer, and a second source electrode and a second drain electrode which are electrically connected to the oxide semiconductor layer.
申请公布号 JP5919232(B2) 申请公布日期 2016.05.18
申请号 JP20130157544 申请日期 2013.07.30
申请人 株式会社半導体エネルギー研究所 发明人 山崎 舜平;小山 潤;今井 馨太郎
分类号 H01L21/8234;H01L21/336;H01L21/8238;H01L21/8247;H01L27/08;H01L27/088;H01L27/092;H01L27/105;H01L27/115;H01L29/786;H01L29/788;H01L29/792 主分类号 H01L21/8234
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