Substrate-product substrate combination and device and method for producing a substrate-product substrate combination

摘要

The invention relates to a substrate for producing a substrate-product substrate combination by aligning, bringing into contact, and bonding a contact side of the large-area substrate to a support surface of a carrier substrate, whereby the substrate has a diameter d1, which can be reduced during back-thinning.

主权项

1. A process for producing a substrate-product substrate combination, comprising the steps of:
aligning a contact side of a large-area substrate with a support surface of a carrier substrate, said large-area substrate having a mean diameter d1 that is larger than a mean diameter d2 of the carrier substrate, said large-area substrate having an edge profile that includes a edge radius and said carrier substrate having an edge radius that is smaller than the edge radius of said large-area substrate; bringing said contact side of said large-area substrate into contact with said support surface of said carrier substrate; bonding said contact side of said large-area substrate to said support surface of said carrier substrate; and back-thinning said large-area substrate to a predetermined thickness, said edge radius of said large-area substrate dimensioned such that said mean diameter d1 of said large-area substrate is reduce to a diameter approximately equal to said mean diameter d2 of said carrier substrate.