| 发明名称 | Adhesive film and sealing method for organic electronic device using same | ||
| 摘要 | Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan δ) at 60 to 100° C. of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same. | ||
| 申请公布号 | US9343697(B2) | 申请公布日期 | 2016.05.17 |
| 申请号 | US201414528828 | 申请日期 | 2014.10.30 |
| 申请人 | LG Chem, Ltd. | 发明人 | Shim Jung Sup;Yoo Hyun Jee;Lee Seung Min;Chang Suk Ky;Cho Yoon Gyung;Bae Kyung Yul |
| 分类号 | H01L51/54;H01L51/52;C09J7/02;H01L51/56;C09J163/00 | 主分类号 | H01L51/54 |
| 代理机构 | Dentons US LLP | 代理人 | Dentons US LLP |
| 主权项 | 1. An adhesive film for encapsulating an organic electronic element, comprising: a first adhesive layer having a loss coefficient tan δ at 60 to 100° C. of 1 to 5; and a second adhesive layer on one surface of the first adhesive layer, and wherein the first adhesive layer has a lower viscosity than the second adhesive layer. | ||
| 地址 | Seoul KR | ||