Soldering method

摘要

A welding method, including: forming a molten solder in a solder bath, forming a dynamic flow of the molten solder from the solder bath, and contacting an object to be welded with the dynamic flow of the molten solder and conducting welding. The surface of the molten solder includes a reduction layer. The oxygen content of the molten solder is below 10 ppm.

主权项

1. A soldering method, comprising:
1) forming a molten solder in a solder bath; 2) forming a dynamic flow of the molten solder from the solder bath; and 3) contacting an object to be soldered with the dynamic flow of the molten solder;wherein:
a surface of the molten solder comprises a reduction layer; an oxygen content of the molten solder is below 10 ppm; the reduction layer comprises a nonionic surfactant, an antioxidant, and ammonium metaphosphate; the nonionic surfactant is selected from nonylphenol ethoxylates, polyoxyethylene sorbitan monolaurates, or a mixture thereof; the antioxidant is selected from phytic acid, malic acid, citric acid, or a mixture thereof; and the reduction layer comprises between 59 and 80 wt. % of the nonionic surfactant, between 15 and 40 wt. % of the antioxidant, and between 0.5 and 5 wt. % of ammonium metaphosphate.