LED ARRAY AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an LED array having sufficient heat dissipation properties even without an additional heat sink.SOLUTION: An LED array of the present invention includes: a wiring board including a metal plate having front and rear surfaces, a wiring pattern and a thickness of 130 μm or more, and a first resin film provided on the rear surface of the metal plate; and a plurality of LEDs fixed upon the front surface of the metal plate. The LED array does not include a heat sink for dissipating heat generated from the LEDs.SELECTED DRAWING: Figure 1