| 摘要 |
PROBLEM TO BE SOLVED: To provide an encapsulation device capable of efficiently performing encapsulation with high air-tightness, and an encapsulation method using the same.SOLUTION: An encapsulation device for an electronic component configured to encapsulate a container in which the electronic component is accommodated, and a lid in an airtight manner comprises a heating line and an encapsulation line next to the heating line, and comprises transfer means including a pallet on which the container and the lid are mounted, for transferring the pallet between the heating line and the encapsulation line. Both the container and the lid are in direct contact with a brazing material, and an encapsulation jig lid is placed on the pallet. The encapsulation jig lid includes a hole through which a load pin can be passed but the container and the lid cannot be passed.SELECTED DRAWING: None |
