发明名称 MOUNTING STRUCTURE OF LED LIGHT EMISSION ELEMENT PACKAGE TO FOAMED RESIN METAL COATING COMPOSITE SHEET BOARD AND FOAMED RESIN METAL COATING COMPOSITE SHEET BOARD FOR LED LIGHTING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a foamed resin metal coating composite sheet board that has a high light reflection characteristic, is light in weight and can properly suppress temperature increase when LED illumination is used, and a mounting structure using the same.SOLUTION: An insulating micro-foamed resin sheet has non-foamed layers on one surface and the other surface, and a micro-foamed layer between the two non-foamed layers. The surface of the non-foamed layer on the one surface is a light reflection plate, and the other surface is a non-foamed layer or micro-foamed layer. A foamed resin metal coating composite sheet board has a copper foil or copper alloy foil which is joined to the surface of the non-foamed layer or the micro-foamed layer on the other surface, and the copper foil or the copper alloy foil of the foamed resin metal coating composite sheet board is a wiring circuit for electric conduction. The foamed resin metal coating composite sheet board has an opening portion which is sized such that a case portion of an LED light emission element package can be inserted into the opening portion. A light emission face of the case portion of the LED light emission package is disposed in the opening portion of the board, and disposed substantially in parallel to at least a part of the other non-foamed layer of the board.SELECTED DRAWING: Figure 1(a)
申请公布号 JP2016082235(A) 申请公布日期 2016.05.16
申请号 JP20150200829 申请日期 2015.10.09
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 INOUE SHOTA;KUBOTA TETSUJI;YAMAMOTO SHUNJI;MATSUNAGA YOSHINORI;KOKUBO YOSUKE
分类号 H01L33/00;F21S8/10;F21V19/00;F21V23/00;F21V29/503;F21V29/76;H05K1/02;H05K1/18 主分类号 H01L33/00
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