发明名称 |
MOUNTING STRUCTURE OF LED LIGHT EMISSION ELEMENT PACKAGE TO FOAMED RESIN METAL COATING COMPOSITE SHEET BOARD AND FOAMED RESIN METAL COATING COMPOSITE SHEET BOARD FOR LED LIGHTING EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a foamed resin metal coating composite sheet board that has a high light reflection characteristic, is light in weight and can properly suppress temperature increase when LED illumination is used, and a mounting structure using the same.SOLUTION: An insulating micro-foamed resin sheet has non-foamed layers on one surface and the other surface, and a micro-foamed layer between the two non-foamed layers. The surface of the non-foamed layer on the one surface is a light reflection plate, and the other surface is a non-foamed layer or micro-foamed layer. A foamed resin metal coating composite sheet board has a copper foil or copper alloy foil which is joined to the surface of the non-foamed layer or the micro-foamed layer on the other surface, and the copper foil or the copper alloy foil of the foamed resin metal coating composite sheet board is a wiring circuit for electric conduction. The foamed resin metal coating composite sheet board has an opening portion which is sized such that a case portion of an LED light emission element package can be inserted into the opening portion. A light emission face of the case portion of the LED light emission package is disposed in the opening portion of the board, and disposed substantially in parallel to at least a part of the other non-foamed layer of the board.SELECTED DRAWING: Figure 1(a) |
申请公布号 |
JP2016082235(A) |
申请公布日期 |
2016.05.16 |
申请号 |
JP20150200829 |
申请日期 |
2015.10.09 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
INOUE SHOTA;KUBOTA TETSUJI;YAMAMOTO SHUNJI;MATSUNAGA YOSHINORI;KOKUBO YOSUKE |
分类号 |
H01L33/00;F21S8/10;F21V19/00;F21V23/00;F21V29/503;F21V29/76;H05K1/02;H05K1/18 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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