发明名称 LIGHT-EMITTING ELEMENT PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a light-emitting element package having improved reliability, a lighting system including the same.SOLUTION: A light-emitting element package includes a substrate 110, a light-emitting structure 120 including a first conductivity type semiconductor layer 122, an active layer 124 and a second conductivity type semiconductor layer 126, a first electrode 132 and a second electrode 134 connected, respectively, with the first and second conductivity type semiconductor layers, a first pad 142 connected with the first electrode in a (1-1)th through hole TH11, that is a part of a first through hole penetrating the second conductivity type semiconductor layer and active layer and exposing the first conductivity type semiconductor layer, a first isolation layer 150 arranged between the first pad and the second conductivity type semiconductor layer and between the first pad and active layer, and arranged to cover the first electrode, and a second pad 144 connected with a second electrode via a second through hole TH2 penetrating the first isolation layer arranged below the second conductivity type semiconductor layer. The second pad is arranged so as not to overlap the first isolation layer, located in the first and second through holes, in the thickness direction of the light-emitting structure.SELECTED DRAWING: Figure 2
申请公布号 JP2016082231(A) 申请公布日期 2016.05.16
申请号 JP20150199279 申请日期 2015.10.07
申请人 LG INNOTEK CO LTD 发明人 YI SAN-YORU;CHOI KWANG KI
分类号 H01L33/38;H01L33/24;H01L33/62 主分类号 H01L33/38
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