发明名称 |
SCRIBING METHOD AND SCRIBING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To smoothly form a crack having a sufficient depth in a substrate over the full length of a scribe line even when the scribe line is formed at a position right above and right under a sealant.SOLUTION: A scribing method comprises: displacing upper and lower scribing wheels 301 and 401 to each other in the scribing direction; moving them along a sealant SL to form scribe lines on the upper and lower surfaces of a mother substrate G; adjusting the movements of the scribing wheels 301 and 401 so as to substantially simultaneously pass the scribing wheels 301 and 401 on the other scribe lines LV1 and LV2; displacing the scribing wheels 301 and 401 to each other in the scribing direction after being passed on the other scribe lines LV1 and LV2; and moving them along the sealant to form scribe lines on the upper and lower surfaces of the mother substrate G.SELECTED DRAWING: Figure 15 |
申请公布号 |
JP2016079075(A) |
申请公布日期 |
2016.05.16 |
申请号 |
JP20140214061 |
申请日期 |
2014.10.20 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
MORI AKIRA;SAKAGUCHI RYOTA |
分类号 |
C03B33/027;B28D5/00;G02F1/13 |
主分类号 |
C03B33/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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