发明名称 SCRIBING METHOD AND SCRIBING APPARATUS
摘要 PROBLEM TO BE SOLVED: To smoothly form a crack having a sufficient depth in a substrate over the full length of a scribe line even when the scribe line is formed at a position right above and right under a sealant.SOLUTION: A scribing method comprises: displacing upper and lower scribing wheels 301 and 401 to each other in the scribing direction; moving them along a sealant SL to form scribe lines on the upper and lower surfaces of a mother substrate G; adjusting the movements of the scribing wheels 301 and 401 so as to substantially simultaneously pass the scribing wheels 301 and 401 on the other scribe lines LV1 and LV2; displacing the scribing wheels 301 and 401 to each other in the scribing direction after being passed on the other scribe lines LV1 and LV2; and moving them along the sealant to form scribe lines on the upper and lower surfaces of the mother substrate G.SELECTED DRAWING: Figure 15
申请公布号 JP2016079075(A) 申请公布日期 2016.05.16
申请号 JP20140214061 申请日期 2014.10.20
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 MORI AKIRA;SAKAGUCHI RYOTA
分类号 C03B33/027;B28D5/00;G02F1/13 主分类号 C03B33/027
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