发明名称 METHOD FOR FORMING PENETRATION HOLE IN LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a penetration hole in a laminate which can form the penetration hole, which is small in a difference in a processing shape between a glass substrate layer and a resin composition layer and in a degree of taper, in the laminate having the glass substrate layer and the resin composition layer.SOLUTION: The method for forming a penetration hole in a laminate having at least one resin composition layer and at least one glass substrate layer performs: a step of providing a metal film having an opening part as a conformal mask on one surface of the laminate; and a step of irradiating laser light to the laminate exposed into the opening part.SELECTED DRAWING: None
申请公布号 JP2016078038(A) 申请公布日期 2016.05.16
申请号 JP20140209319 申请日期 2014.10.10
申请人 HITACHI CHEMICAL CO LTD 发明人 YAMAZAKI YUKA;SHIMAZAKI TOSHIKATSU;MURAI HIKARI
分类号 B23K26/382;B23K26/066;B32B3/24;B32B17/10;H05K3/00 主分类号 B23K26/382
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