METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, METAL MOLD AND LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of reducing a cost of manufacture of the semiconductor device.SOLUTION: Provided is a method of manufacturing a semiconductor device including: a step of sandwiching a lead 12 between a first mold 1 and a second mold 2 and accommodating a die pad 11 and the like in a space S1; and injecting a resin into the space S1 and hardening the resin to encapsulate the die pad 11 and the like by the resin. When a first surface 11a of the die pad 11 is directed to the second mold 2, a second surface 11b is separated from a bottom face 4a of a first recessed part 4. When the first surface 11a of the die pad 11 is directed to the first mold 1, the second surface 11b is contacted with a bottom face 5a of a second recessed part 5. In a case where a type of the semiconductor device in which the second surface 11b is covered with the resin is manufactured, the die pad 11 and the like are accommodated in the space S1 while directing the first surface 11a to the second mold 2. In a case where a type of the semiconductor device in which the second surface 11b is exposed from the resin is manufactured, the die pad 11 and the like are accommodated in the space S1 while directing the first surface 11a to the first mold 1.SELECTED DRAWING: Figure 1