发明名称 Verpackung für Halbleiterelemente
摘要 A plurality of semiconductor elements 12 are located within suitahble carriers 13, and a plurality of such carriers 13 are enclosed within a bag 17 or other container. The bag 17 is made from a moisture-proof film 11 which is air sealed to enclose the elements 12. To eliminate moisture within the bag 17, a desiccant may be provided within the bag 17 and/or within the carriers 13. Furthermore a humidity indicator 15 may be provided within the bag 17, which is visible from the outside of the bag 17, and hence provides a visual indication if there is condensation within the bag 17 which could affect the elements 12. As a further step, the film 11 may be multi-layered with one layer being a metal sheet. In this way, contamination by moisture of the semiconductor elements during storage or transport may be reduced, thereby reducing the risk of damage when the semiconductor elements are mounted on a substrate.
申请公布号 DE3751687(T2) 申请公布日期 1996.08.14
申请号 DE19873751687 申请日期 1987.11.24
申请人 HITACHI, LTD., TOKIO/TOKYO, JP 发明人 KITAMURA, WAHEI, KODAIRA-SHI, TOKYO, JP;NISHI, KUNIHIKO, KOKUBUNJI-SHI, TOKYO, JP;MURAKAMI, GEN, MACHIDA-SHI, TOKYO, JP
分类号 B32B27/08;B65D79/02;B65D81/26;H01L21/00;H01L21/673;H01L23/31;H01L23/495;H05K13/00 主分类号 B32B27/08
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