发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device that can exclude waste of an electronic component which is discarded after used for trial coating when paste is additionally coated on the lower surface of an electronic component, and also minutely adjust the coating amount and the coating position.SOLUTION: Trial coating for adjustment of a coating amount and correction of a coating position when paste P is coated on the lower surfaces of electronic components 20 is performed on a measurement member 21 as a dummy work piece which is taken out from a measurement member feeder 5b mounted in a common feeder base of a component supplier by using a suction nozzle 10 of a mounted head. The trially coated measurement member 21 is recognized by a recognition unit, and adjustment of the coating amount and correction of the coating position are performed on the basis of the recognition result. Accordingly, as compared with a prior art which uses an actual electronic component for trial coating, waste of an electronic component which is discarded after used can be excluded, and minute adjustment of the coating amount and the coating position can be performed.SELECTED DRAWING: Figure 9
申请公布号 JP2016082084(A) 申请公布日期 2016.05.16
申请号 JP20140212470 申请日期 2014.10.17
申请人 PANASONIC IP MANAGEMENT CORP 发明人 ABE SHIGETAKA;HAJI HIROSHI
分类号 H05K13/04;H01L21/60;H05K3/34;H05K13/08 主分类号 H05K13/04
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