| 摘要 |
PROBLEM TO BE SOLVED: To enhance connection reliability of a through electrode and an upper wiring layer, while reducing the manufacturing cost of a multilayer wiring board, by connecting the upper wiring layer and lower wiring layer of a build-up multilayer wiring board by means of a through electrode.SOLUTION: In a multilayer wiring board having a through electrode connecting an upper wiring layer and a lower wiring layer, upper part of the through electrode located above the lower wiring layer is covered with a connection land, and formed larger than the diameter at the lower part of the through electrode, the upper wiring layer is formed on the connection land, and a lower wiring pattern not exceeding the height of the lower part of the through electrode is formed.SELECTED DRAWING: Figure 2 |
