| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emission device that can enhance the heat radiation performance and the mounting strength based on soldering with neither increasing the size nor complexing the structure.SOLUTION: A light emission device 1 has a board 2 having through-holes 2b, 2c at a position where a light emission element 5 is to be mounted, a metal post 3 having projecting portions 3a, 3b which are fitted in the through-holes 2b, 2c from the back surface side, and electrode portions 3c, 3d projecting to the back surface side of the board 2, and a wiring pattern 4 which is formed on the surface of the board 2 and contacts the projecting portions 3a, 3b. The electrode portions 3c, 3d of the metal post 3 in the light emission device 1 are electrodes which are conducted to the wiring pattern 4 through the projecting portions 3a, 3b. Accordingly, it is unnecessary to provide the metal post and the electrodes separately from each other, and the degree of freedom of the arrangement and shape of the metal post and the electrodes can be enhanced. Furthermore, the thickness and area of the metal post can be increased without increasing the size of the outer shape, and the heat quantity thereof can be increased, so that the heat radiation performance can be enhanced.SELECTED DRAWING: Figure 2 |
