METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, METAL MOLD AND LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of reducing a cost of manufacture of the semiconductor device.SOLUTION: Provided is a method of manufacturing a semiconductor device including: a step of sandwiching a lead 12 of a lead frame 10 between a first mold 1 and a second mold 2 and accommodating a die pad 11 and the like in a space S1; and a step of injecting a resin into the space S1 and hardening the resin to encapsulate the die pad 11 and the like. A set 41 of first support pins and a set 42 of second support pins are provided on the first mold 1 and the second mold 2. Depending on a type of the lead frame 10, any one of the two sets 41 and 42 of support pins abuts on a support pin contact part 14.SELECTED DRAWING: Figure 2