| 摘要 |
The present invention relates to a substrate treating device. A substrate treating device according to an embodiment of the present invention of the present invention includes: a load port where a container receiving a substrate is seated; a treating module treating the substrate; a transferring module returning the substrate from/to the container to/from the treating module; and a controller controlling the load port, the transferring module, and the treating module. The treating module includes: a transfer chamber returning the substrate; a load lock chamber arranged between the transfer chamber and the transferring module; and a treatment chamber arranged in the periphery of the transfer chamber to be separated from the transferring module and treating the substrate. The transfer chamber includes: a housing having an internal space; a robot positioned inside the housing and returning the substrate from/to the transferring module to/from the processing chamber; and a sensor unit sensing a location parameter of the substrate transferred by the returning robot. The controller is capable of controlling the sensor unit to be automatically calibrated at a preset timing. The purpose of the embodiment of the present invention is to provide the substrate treating device capable of improving treatment efficiency by automatically calibrating the returning robot. |
