摘要 |
An adhesive film according to the present invention has a modulus distribution according to a temperature, wherein the modulus distribution uses a temperature as an x axis (°C) and a modulus as a y axis (KPa). An average slope is -9.9 to 0 in a section between -20°C and 80°C, and a modulus at 80°C is 10 to 1,000 KPa. The adhesive film is made of an adhesive composition, and the adhesive composition may comprise a (meth)acrylic copolymer having a hydroxyl group and an organic particle. Viscoelasticity is maintained in a wide temperature section, and recovering properties are also excellent. |
申请人 |
SAMSUNG SDI CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JI HO;MOON, HYUNG RANG;KIM, IL JIN;KWAK, BYEONG DO;KIM, JEE HEE;MUN, SUNG HYUN;SHIN, SEON HEE;LEE, GWANG HWAN;LEE, WOO JIN;LEE, EUN HWA;CHO, IK HWAN;HAN, JAE HYUN |