| 摘要 |
The present invention relates to a plasma cutting apparatus, and a cutting method for an object using the same. According to the present invention, a plasma cutting apparatus comprises: a plasma torch to cut an object; an information acquisition unit to acquire voltage information between the plasma torch and the object in accordance with a cumulative time to perform work for the plasma torch to cut the object; and a clearance adjustment unit to adjust a clearance between the plasma torch and the object based on the voltage information which the information acquisition unit acquires. |
