WIRE SOLDERING SYSTEM, AND WIRE SOLDERING METHOD

摘要

The present invention relates to a wire soldering system, and more specifically, to a wire soldering system to fixate a wire in an electronic component such as a camera module using soldering and a wire soldering method. An embodiment of the present invention provides the wire soldering system for a camera module comprising: a camera lens; a lens holder (20) where the camera lens is mounted; and a plurality of wires (30) soldered and fixated to the lens holder (20). The wire soldering system further comprises: a lens holder mount unit (120) where the at least one lens holder (20) is mounted while the wire (30) vertically penetrates through and is inserted; and a wire soldering unit (200) located in an upper part of the lens holder mount unit (120) to fixate the wire (30) in a mount hole (21) of the lens holder mounted on the lens holder mount unit (120) using a solder material (39). The wire soldering unit (200) includes: a solder material spray unit (210) to spray the solder material (39) to an end of the wire (30) inserted into the mount hole (21) of the lens holder (20); and a laser irradiation unit (230) to melt the solder material (39) by irradiating the solder material (39) sprayed by the solder material spray unit (210) with laser.