LASER FIBER ARRAY FOR SINGULATING SEMICONDUCTOR WAFERS

摘要

A device for cutting a substrate comprises first and second lasers, and first and second optical fibers having input ends and output ends opposite to the input ends respectively. The input ends of the first and second optical fibers are connected to the first and second lasers respectively. The output ends of the first and second optical fibers are movable with respect to the substrate, and are configured to simultaneously image first and second laser beams onto the substrate for cutting the substrate. Therefore, the device can simultaneously generate a plurality of laser beams.