THERMAL STABILIZATION OF TEMPERATURE SENSITIVE COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an enclosure for thermally stabilizing temperature sensitive components on a circuit board.SOLUTION: An enclosure 100 comprises a first cover section 110 configured to be mounted over a portion of a first side 212 of a circuit board 210 where at least one temperature sensitive component 216 is mounted. The first cover section includes a first lid and at least one sidewall extending from the perimeter of the first lid. The enclosure also includes a second cover section 140 configured to be mounted over a portion of a second side 214 of the circuit board opposite from the first cover section. The second cover section includes a second lid and at least one sidewall extending from the perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.SELECTED DRAWING: Figure 3