HEAT EXCHANGE STRUCTURE, METHOD FOR PRODUCING SAME, HEAT EXCHANGE DEVICE COMPRISING SUCH A STRUCTURE AND USES OF SAME

摘要

A heat exchange structure, and an assembly as well as to a heat exchange device comprising such a structure, applying heat transfer by boiling of a liquid and comprising a substrate and at least one layer intended to be in contact with a liquid and at least partly positioned on the substrate. The composition of this layer comprises at least a molecular switch having a lower critical solubility temperature TLCST above which it gives the layer non-wetting properties towards the liquid and below which it gives the layer wetting properties towards the liquid, this lower critical solubility temperature TLCST of the molecular switch being selected so as to be greater than or equal to the saturation temperature Tsat of the liquid.

主权项

1. A heat exchange structure applying a heat transfer by boiling a liquid, said heat exchange structure comprising:
a substrate and a heat exchange surface intended to be in contact with said liquid, said heat exchange surface comprising at least one molecular switch having a lower critical solubility temperature TLCST above which it gives the heat exchange surface non-wetting properties towards the liquid and below which it gives to the heat exchange surface wetting properties towards the liquid, this lower critical solubility temperature TLCST of the molecular switch being selected so as to be greater than or equal to the saturation temperature Tsat of the liquid.