| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin molding for LED package exhibiting high adhesion and adhesiveness to the lead frame while reducing the unshaped places, even if a thermosetting resin of high curing rate, and less likely to fill the mold cavity, is used at the time of transfer molding, and to provide a method of producing the same, and a molding die for use during production.SOLUTION: A resin molding for LED package including a plurality of recesses 8 arranged in matrix has a molding part where film gates 6 and recesses 8 are arranged in matrix, and the width of the film gate 6 on the resin molding side is equal to or larger than the width of the recess.SELECTED DRAWING: Figure 1 |
