| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot melt adhesive that can be applied at a low temperature, has excellent blocking resistance, and has excellent properties, such as heating stability, adhesiveness, and heat creep resistance.SOLUTION: A hot melt adhesive according to the present invention contains 100 pts.mass of an ethylene-vinyl acetate copolymer having a melt flow rate of 500 g/10 min or more, 50-400 pts.mass of a C9 petroleum resin, and 50-100 pts.mass of wax. Consequently, the hot melt adhesive can be applied at a low temperature, has excellent blocking resistance, and has excellent properties, such as heating stability, adhesiveness, and heat creep resistance.SELECTED DRAWING: Figure 1 |
