发明名称 ULTRATHIN LED LIGHT ENGINE
摘要 An ultrathin LED light engine (100) comprises a protective cover (106), a driving circuit board (101), an aluminum substrate (103) and at least one LED module (104). A double-sided high-viscosity heat conducting plate (102) covers the first surface of the aluminum substrate (103) to fix the driving circuit board (101); the at least one LED module (104) is fixed on the first surface and insulated from the aluminum substrate (103) by means of an insulating layer (200) on the first surface; a conductive circuit for electrically connecting the at least one LED module (104) and the driving circuit board (101) is arranged on the insulating layer (200); and the size of the aluminum substrate (103) at least at the local peripheral outer area is greater than that of the driving circuit board (101), so that the double-sided high-viscosity heat conducting plate (102) on the first surface at least locally fixes the protective cover (106). The LED light engine (100) realizes ultrathin design and built-in integration of drive and control devices, and realizes heat conduction and fixation of the PCB and the protective cover by using a double-sided high-viscosity film.
申请公布号 US2016131350(A1) 申请公布日期 2016.05.12
申请号 US201414893869 申请日期 2014.06.06
申请人 SICHUAN SUNFOR LIGHT CO., LTD. 发明人 LI Gang;LONG Wentao;ZHAO Wei;LUO Chao;TANG Chao;LI Dongming
分类号 F21V23/00;H05K1/11;H05K1/05;F21V29/70;F21K99/00 主分类号 F21V23/00
代理机构 代理人
主权项 1. An ultrathin LED light engine, comprising a protective cover; a driving circuit board; an aluminum substrate and at least one LED module, wherein a double-sided high-viscosity heat conducting plate covers a first surface of the aluminum substrate to secure the driving circuit board, wherein the at least one LED module is secured on the first surface and insulated from the aluminum substrate by means of an insulating layer on the first surface, wherein a conductive circuit is disposed on the insulating layer for electrically connecting the at least one LED module and the driving circuit board, and wherein at least an outer peripheral area of the aluminum substrate is larger than an outer peripheral area of the driving circuit board, so that the double-sided high-viscosity heat conducting plate on the first surface secures the protective cover at least at a partial area.
地址 Chengdu, Sichuan CN