| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for an electronic module, the substrate having a top surface good in solder wettability.SOLUTION: A substrate 10 includes a plurality of members integrated in a laminated manner, and includes, as the plurality of members, at least, a Ni plate 1 formed of Ni or a Ni alloy and having a top surface 1a to which an electronic element is joined by soldering, a metal circuit board 4, and an insulating plate 6. Among the plurality of members, at least two members adjacent to each other are joined by brazing, and then an oxide film formed on the top surface 1a of the Ni plate 1 during brazing is removed by a hydrogen reduction method.SELECTED DRAWING: Figure 2 |
