发明名称 MANUFACTURING METHOD OF CONNECTION STRUCTURE, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure capable of improving manufacture efficiency of the connection structure.SOLUTION: The manufacturing method of the connection structure includes the steps of: disposing a first conductive paste layer on a surface of one of a first connection object member and a second connection object member; disposing one of the second connection object member and the first connection object member on a surface of the first conductive paste layer; forming a first connection part connecting the first connection object member and the second connection object member from the first conductive paste layer by heating the first conductive paste layer, and electrically connecting a first conductor part and a second conductor part by a first solder part; and forming an inter-via connection conductor part communicating to a first via of the first connection object member and a second via of the second connection object member from a conductor material for inter-via connection.SELECTED DRAWING: Figure 1
申请公布号 JP2016076355(A) 申请公布日期 2016.05.12
申请号 JP20140205191 申请日期 2014.10.03
申请人 SEKISUI CHEM CO LTD 发明人 ISHIZAWA HIDEAKI
分类号 H01R43/00;H01R11/01;H05K1/14 主分类号 H01R43/00
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