| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure capable of efficiently disposing solder particles between conductor parts and improving conduction reliability between the conductor parts.SOLUTION: The manufacturing method of the connection structure includes the steps of: disposing a first conductive paste layer on a surface of one of a first connection object member and a second connection object member; disposing one of the second connection object member and the first connection object member on a surface of the conductive paste layer; and forming a first connection part connecting the first connection object member and the second connection object member from the first conductive paste layer by heating the first conductive paste layer to a fusion point of solder particles or higher and a setting temperature of a thermosetting component or higher, and electrically connecting a first conductor part and a second conductor part via a first solder part derived from the solder particles.SELECTED DRAWING: Figure 1 |
