OPTIMIZING THE UTILIZATION OF METROLOGY TOOLS

摘要

Methods and corresponding metrology modules and systems, which measure metrology parameter(s) of a previous layer of a metrology target and/or an alignment mark, prior to producing a current layer of the metrology target, derive merit figure(s) from the measured metrology parameter(s) to indicate an inaccuracy, and compensate for the inaccuracy to enhance subsequent overlay measurements of the metrology target. In an example embodiment, methods and corresponding metrology modules and systems use stand-alone metrology tool(s) and track-integrated metrology tool(s) at distinct measurement patterns to address separately different aspects of variation among wafers.

主权项

1. A method comprising:
measuring, prior to producing a current layer of the metrology target:
at least one metrology parameter of at least one of a previous layer of a metrology target andan alignment mark deriving at least one merit figure from the at least one measured metrology parameter to indicate an inaccuracy, and compensating for the inaccuracy to enhance subsequent overlay measurements of the metrology target.