| 发明名称 |
DUAL SIDED CIRCUIT FOR SURFACE MOUNTING |
| 摘要 |
A method of forming an integrated circuit, including providing a first substrate layer having a center piece and two side pieces on opposite sides of the center piece, assembling one or more circuit elements on a top side and a bottom side of the center piece of the first substrate layer, preparing two support pieces from a substrate, matching the size of the side pieces, coupling the support pieces to the bottom of the first substrate layer under the side pieces to form a second substrate layer with a void in the center under the center piece of the first substrate layer; and wherein the side pieces and support pieces include via connectors electrically connecting between a bottom side of the second substrate layer and the circuit elements. |
| 申请公布号 |
US2016133561(A1) |
申请公布日期 |
2016.05.12 |
| 申请号 |
US201414534195 |
申请日期 |
2014.11.06 |
| 申请人 |
ORIGIN GPS LTD. |
发明人 |
GOLDBERGER Haim |
| 分类号 |
H01L23/522;H01L21/48;H01L21/768;H01L21/50 |
主分类号 |
H01L23/522 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming an integrated circuit, comprising:
providing a first substrate layer having a center piece and two side pieces on opposite sides of the center piece; assembling one or more circuit elements on a top side and a bottom side of the center piece of the first substrate layer; preparing two support pieces from a substrate, matching the size of the side pieces; coupling the support pieces to the bottom of the first substrate layer under the side pieces to form a second substrate layer with a void in the center under the center piece of the first substrate layer; and wherein the side pieces and support pieces include via connectors electrically connecting between a bottom side of the second substrate layer and the circuit elements. |
| 地址 |
Airport City IL |
