发明名称 BONDED HELICAL COMPRESSION SPRING
摘要 PROBLEM TO BE SOLVED: To provide lightweight compression spring which can prove sufficient stiffness for a wide variety of applications and has an improved resistance to fatigue and corrosion.SOLUTION: A bonded helical compression spring 10 is provided. The spring includes a plurality of layers 12 having successive wave crests 14 and troughs 16. First crests and first troughs of a first layer are aligned with respective second troughs and second crests of an adjacent second layer and with respective third troughs and third crests of an adjacent third layer. The first crests of the first layer are bonded to the second troughs of the adjacent second layer and the first troughs of the first layer are bonded to the third crests of the adjacent third layer. Since the crests and troughs of adjacent layers are bonded together, friction between the crests and troughs is eliminated.SELECTED DRAWING: Figure 1
申请公布号 JP2016075390(A) 申请公布日期 2016.05.12
申请号 JP20150196488 申请日期 2015.10.02
申请人 TYCO ELECTRONICS CORP 发明人 KENT D RUSSELL;CHARLES DAVID FRY
分类号 F16F1/06;B32B1/04;B32B3/28;F16F1/373 主分类号 F16F1/06
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