发明名称 IMAGE SENSOR WITH DEEP WELL STRUCTURE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To bring about an image sensor capable of reducing crosstalk between pixels while improving quantum efficiency, and improvement in a method of manufacturing the same.SOLUTION: An image sensor device includes a substrate having a first conductivity type. A plurality of photosensitive regions including first, second and third photosensitive regions, corresponding to R, G and B pixels, are provided on a substrate. In order to separate the photosensitive regions each other, an insulation structure is arranged on the substrate. A photodiode structure is formed in each photosensitive region. A deep well structure has a second conductivity type. The deep well structure overlaps only the second and third photosensitive regions. The deep well structure does not overlap the first photosensitive region.SELECTED DRAWING: Figure 1
申请公布号 JP2016076679(A) 申请公布日期 2016.05.12
申请号 JP20150002966 申请日期 2015.01.09
申请人 POWERCHIP TECHNOLOGY CORP 发明人 CHUNG CHIH-PING;PENG CHIH-HAO;HO MING-YU;HITSU KAKEI
分类号 H01L27/146;H01L31/02 主分类号 H01L27/146
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