| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a main pad part and a sub pad part formed in a peripheral area of at least one side of the main pad part. The sub pad part is spaced apart from the main pad part. The sub pad part operates in a first state in which the sub pad part is short-circuited with the main pad part or in a second state in which the sub pad part is open from the main pad part. |
| 申请公布号 |
US2016133586(A1) |
申请公布日期 |
2016.05.12 |
| 申请号 |
US201514789247 |
申请日期 |
2015.07.01 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
CHO Chang-hyun;LEE Jun-phyo;JEONG Yong-hwan |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a substrate; a circuit pattern layer on the substrate; and a multi-function pad connected to the circuit pattern layer through a plug, the multi-function pad including a main pad part and a sub pad part, wherein the sub pad part is formed in a peripheral area of at least one side of the main pad part, the sub pad part is spaced apart from the main pad part, and the sub pad part is configured to operate in a first state in which the sub pad part is short-circuited with the main pad part or in a second state in which the sub pad part is open from the main pad part. |
| 地址 |
Suwon-si KR |
