| 摘要 |
The present invention provides a laser processing apparatus which can prevent debris generated at the time of a processing point from being attached to the surface of a workpiece. The laser processing apparatus (1) comprises a chuck table (10) for maintaining the workpiece (W), a laser beams irradiation means (20) for irradiating a laser beam (L) to the workpiece (W), and a debris attachment preventing means (60) for preventing the debris (G) generated at the time of a processing point (P) from being attached to the workpiece (W). The debris attachment preventing means (60) comprises a main body (61) which takes shelter from the laser beam (L) irradiated to the workpiece (W) and is installed in the vicinity of the processing point (P), and a fluid supply path (67) that connects an aperture (66) formed in the bottom surface (64a) of the main body (61) and a fluid supply source (68). The bottom surface (64a) has a small gap (C) from the surface (WS) of the workpiece (W) maintained in the chuck table (10) and meets face-to-face and is held in substantially parallel. The fluid is supplied to the bottom surface (64a) of the main body (61) from the aperture (66) and the gap (C) of the surface (WS) of the workpiece (W). |
