PHOTOSENSITIVE RESIN COMOPSITION

摘要

The present invention relates to a negative-type photosensitive resin composition. More specifically, the negative-type photosensitive resin composition comprises: an alkali soluble resin (A) including a repeating unit represented by chemical formula 1; a siloxane resin (B) polymerized by including 10 to 20 mol% of a monomer represented by chemical formula 2 and 1 to 8 mol% of a monomer represented by chemical formula 3; a polymerizable compound (C); a multifunctional thiol compound (D) having three or more functionalities; a photopolymerization initiator (E); and a solvent (E). Accordingly, reactivity is excellent even in a low temperature hardening condition, and a pattern having excellent durability may be produced.