| 摘要 |
Embodiments of the invention provide a power semiconductor module wherein it is possible to reduce switching noise generated in a switching element, and at the same time, to reduce thermal resistance between a power semiconductor chip and an insulating substrate. In some embodiments, by a capacitor being installed between a printed substrate and an insulating substrate so as to be adjacent to a power semiconductor chip which is a switching element, it is possible to reduce switching noise generated in the switching element, and furthermore, it is possible to reduce thermal resistance between the power semiconductor chip and insulating substrate. |
