SILICONE RESIN, RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE, AND MAKING METHOD

摘要

A silicone resin of the present invention is a silicone resin which has a structural unit of compositional formula (1), and has a weight average molecular weight of 3,000 - 500,000. The silicone resin comprises a silicone resin having a silicon content of 10-40 wt% (A-1); and a silicone resin having a silicon content of 50-80 wt% (A-2). The weight content of the silicone resin (A-1) with respect to the total weight of the silicone resin is 10-50 wt%. (Both a and b are positive numbers; the sum of a and b is 1; X represents a divalent connecting group for general formula (2), or general formulas (2) and (3). When c represents a mole number of a unit represented by the general formula (2) and d represents a mole number of a unit represented by the general formula (3), c : d is defined by c as 1 and d as 0 <= d <= 1.) The silicone resin of the present invention: can be processed into a film; has excellent molding properties for a thin film wafer having a large diameter; has excellent adhesion, low flexibility, and wafer protection; can collectively mold silicon wafers; and becomes a resin film which can be appropriately used for a wafer level package.