发明名称 半導体受光素子
摘要 According to one embodiment, a semiconductor light-receiving element, includes a light-receiving part provided on a substrate and having a semiconductor multilayer structure of a circular outer shape, a optical input part formed of a peripheral portion of the semiconductor multilayer structure, and having a tapered front end, and a silicon-thin-line waveguide configured to couple light with the optical input part. The waveguide includes a linear part extending through the optical input part to an at least one area of an upper-side area and a lower-side area of the light-receiving part, and a spiral part connected to the linear part and formed in the at least one area.
申请公布号 JP5914605(B2) 申请公布日期 2016.05.11
申请号 JP20140190679 申请日期 2014.09.19
申请人 株式会社東芝;技術研究組合光電子融合基盤技術研究所 发明人 吉田 春彦;大平 和哉;江崎 瑞仙
分类号 H01L31/10 主分类号 H01L31/10
代理机构 代理人
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