Radiation-emitting semiconductor device

摘要

A radiation-emitting semiconductor device includes a chip connection region, a radiation-emitting semiconductor chip, and a light-absorbing material, wherein the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip, and the radiation-emitting semiconductor chip is free of the light-absorbing material in locations.

主权项

1. A radiation-emitting semiconductor device comprising:
a housing body having a chip mounting area; a chip connection region; a radiation-emitting semiconductor chip; a wire connection region; a wire electrically conductively connecting the wire connection region to the radiation-emitting semiconductor chip; and a light-absorbing material, wherein the chip connection region and the wire connection region are arranged at the chip mounting area, the radiation-emitting semiconductor chip is fixed to the chip connection region, the chip connection region is covered with the light-absorbing material at selected locations at which said chip connection region is not covered by the radiation-emitting semiconductor chip, the wire connection region is covered with the light-absorbing material at selected locations at which it is not covered by the wire, the radiation-emitting semiconductor chip is free of the light-absorbing material in selected locations, the chip mounting area is free of the light-absorbing material in selected locations, and the housing body and the light-absorbing material are the same color.